Processed Resin Parts

Applications

Parts for silicon wafer manufacturing equipment and semiconductor device fabrication equipment
(CMP machines, Lapping machines, Polishing machines, Beveling machines)

Processing Method

Ⅰ Cutting process
Ⅱ Welding process
Ⅲ Bending process
Ⅳ Uniting process

Major Resin Materials Used

POM (Polyathetal)
PC (Polycarbonate))
PVC (Polyvinyl Chloride)
PMMA (Acryl)
Nylon
PTFE (Teflon)
PEEK (Plyetheretherketone)
PE (Polyethylene)
PBT (Polybutylene Terephthalate)
Urethane Rubber

Examples of Processed Resin Parts

Processed Resin Parts1 Processed Resin Parts2 Processed Resin Parts3